Heavy Copper PCB

ChinaPCBOne is professional Advanced Circuit Manufacturer, We provide 3OZ ~ 19OZ Heavy Copper PCB.

Heavy Copper PCB are generally used for high power distribution, heat dissipation, planar transformers, and power convertors. We can make up to 19oz Heavy Copper PCB.

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Halogen-free FR4 TG150 PCB

Layer Count: 12
Raw Material: Halogen-free FR4 TG150
Surface Treatment: OSP
Special Process: inner copper thickness 5oz, outer copper thickness 2oz,impedance control
Application: Mobile phone fast charging

FR4 TG170 PCB

Layer Count: 6
Raw Material:FR4 TG170
Surface Treatment: Immersion Gold(ENIG)
Special Process: inner copper thickness 4oz, outer copper thickness 4oz
Application: Uav power supply

 

FR4 TG170

Layer Count: 4
Raw Material: FR4 TG170
Surface Treatment: Lead free HASL
Special Process: inner copper thickness 4oz,outer copper thickness 4oz
Application: Power supply module

FR4 TG170 PCB

Layer Count: 2
Raw Material: FR4 TG170
Surface Treatment: Immersion Gold(ENIG)
Special Process: finished copper thichness 6oz
Application: Power supply module

FR4 TG170 PCB

Layer Count: 2
Raw Material: FR4 TG170
Surface Treatment: Immersion Tin
Special Process: finished copper thickness 9oz
Application: Power supply module

FR4 TG170 PCB

Layer Count: 2
Raw Material:FR4 TG170
Surface Treatment: Immersion Gold(ENIG)
Special Process: finished copper thickness 15oz
Application: High power supply

FR4 TG170 PCB

Layer Count: 2
Raw Material: FR4 TG170
Surface Treatment: Immersion Tin
Special Process: Finished copper thickness 9oz
Application: Power supply module

FR4 TG170 PCB

Layer Count: 4
Raw Material: FR4 TG170
Surface Treatment:Lead free HASL
Special Process:inner copper thickness 3oz,outer copper thickness 3oz
Application: Power supply module

FR4 TG170 PCB

Layer Count: 2
Raw Material: FR4 TG170
Surface Treatment: Lead free HASL
Special Process: Finished copper thickness 3oz
Application: Power supply module

Halogen-free FR4 TG150 PCB

Layer Count: 12
Raw Material: Halogen-free FR4 TG150
Surface Treatment: OSP
Special Process: inner copper thickness 5oz, outer copper thickness 2oz,impedance control
Application: Mobile phone fast charging

FR4 TG170 PCB

Layer Count: 2
Raw Material:FR4 TG170
Surface Treatment: Immersion Gold(ENIG)
Special Process: finished copper thickness 15oz
Application: High power supply

FR4 TG170 PCB

Layer Count: 2
Raw Material: FR4 TG170
Surface Treatment: Immersion Tin
Special Process: Finished copper thickness 9oz
Application: Power supply module

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