Rogers PCB

Rogers PCB laminate are the raw materials we have chosen to one of the best. We have prepared a sufficient conventional Rogers PCB laminate stock, that can on time delivery to your Rogers PCB.

ROGERS 4003C and ROGERS 4350B provide a more cost-effective and processable choice of high frequency materials than PTFE due to their excellent low dielectric loss characteristics, and are widely used in cellular base station antennas and power amplifiers, microwave point-to-point connectivity (P2P), automotive radar and sensors, radio frequency identification (RFID), high frequency head (LNB) of direct broadcast satellites, and other fields. Besides, the thermal expansion coefficient of X and Y axis is similar to the copper, and the expansion coefficient of Z axis is much lower than FR4 (46ppm/oC), and has a high Tg value (>280oC), which guarantees the good dimensional stability and high reliability of the whole product in the PCB process and assemble, and it will bring more benefits to the design of multi-layer circuit.

ROGERS 4003C and ROGERS 4350B provide a more cost-effective and processable choice of high frequency materials than PTFE due to their excellent low dielectric loss characteristics, and are widely used in cellular base station antennas and power amplifiers
, microwave point-to-point connectivity (P2P), automotive radar and sensors, radio frequency identification (RFID), high frequency head (LNB) of direct broadcast satellites, and other fields. Besides, the thermal expansion coefficient of X and Y axis is similar to the copper, and the expansion coefficient of Z axis is much lower than FR4 (46ppm/oC), and has a high Tg value (>280oC), which guarantees the good dimensional stability and high reliability of the whole product in the PCB process and assemble, and it will bring more benefits to the design of multi-layer circuit.

Our company always has all thickness and specifications of RO4003C, RO4350B and RO4450F semi-curing sheet to meet your rapid response needs, with rich experience in RFID data processing engineers and perfect high-frequency material processing control system, to ensure the realization of product design functions

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FR4 + Rogers4350 + Copper

Layer Count: 6
Raw Material: FR4+RO4350+CU
Surface Treatment: Immersion Gold(ENIG)
Special Process: Mixed Pressure + Insert Copper Coin
Application Area:

 

Rogers 4003

Layer Count:2
Raw Material:RO4003
Surface Treatment:Immersion Gold(ENIG)
Special Process:High frequency materials
Application area:

Rogers + FR4

Layer Count: 8
Raw Material: Rogers+FR4
Surface Treatment: Immersion Gold(ENIG)
Special Process: Mixed Pressure
Application Area:

FR4 + Rogers

Layer Count: 4
Raw Material: FR4+Rogers
Surface Treatment: Immersion Gold(ENIG)
Special Process: Mixed Pressure + Step Control Deep Slot
Application Area:

Rogers

Layer Count: 6
Raw Material: Rogers
Surface Treatment: Immersion Gold(ENIG)
Special Process: Mulitlayer Board With Rogers + Via Fill with Epoxy Resin

FR4 + Rogers

Layer Count: 4
Raw Material: FR4 + Rogers
Surface Treatment: Immersion Gold(ENIG)
Special Process: Mixed Pressure + Step Control Deep Slot
Application area:

FR4 + Rogers4350 + Copper

Layer Count: 6
Raw Material: FR4+RO4350+CU
Surface Treatment: Immersion Gold(ENIG)
Special Process: Mixed Pressure + Insert Copper Coin
Application Area:

Rogers 4003

Layer Count:2
Raw Material:RO4003
Surface Treatment:Immersion Gold(ENIG)
Special Process:High frequency materials
Application area:

Rogers + FR4

Layer Count: 8
Raw Material: Rogers+FR4
Surface Treatment: Immersion Gold(ENIG)
Special Process: Mixed Pressure
Application Area:

Part of the product

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