PCB Material Datasheet - ChinaPCBOne Technology LTD

PCB Material Datasheet

Features:
• Not-PTFE
• Excellent high frequency performance due to
low dielectric tolerance and loss
• Stable electrical properties versus frequency
• Low thermal coefficient of dielectric constant
• Low Z-Axis expansion
• Low in-plane expansion coefficient
• Excellent dimensional stability
• Volume manufacturing process

  09-16-2019

RO4000® dielectric materials have long been used in combination with FR-4 cores and
bondplys as a means to achieve a performance upgrade of standard FR-4 multi-layer
designs. RO4003CTM, RO4350BTM, RO4360G2TM, RO4835TM, RO4835TTM, and RO4000 LoPro®
glass reinforced hydrocarbon/ceramic laminates have been used in layers where operating
frequency, dielectric constant, or high-speed signal requirements dictate the need for high performance materials. FR-4 cores and bondply are still commonly used to inexpensively form less critical signal layers.

  09-16-2019

Glass Reinforced Hydrocarbon Ceramic High Frequency Circuit Material

FEATURES
● Stable electrical properties versus frequency.
● Glass-reinforced hydrocarbon and ceramic dielectric ● Low Z-axis expansion and excellent dimensional
APPLICATIONS
● LNA/LNB
● High frequency wireless communication
● Satellite signal transmission equipment
● Microstrip and Cellular Base Station Antennas ● Base Station Antennas and Power Amplifiers

  09-24-2019

Glass Reinforced Hydrocarbon Ceramic High Frequency Circuit Material

FEATURES
● Glass-reinforced hydrocarbon & ceramic dielectric
● Excellent high frequency performance due to Low dielectric tolerance and loss.
● Stable electrical properties versus frequency.
● Low Z-CTE and excellent dimensional stability.

APPLICATIONS
Microstrip and Cellular Base Station Power Amplifiers;
Antennas; LNA/LNB;
High frequency wireless communication Satellite signal transmission equipment;

  09-24-2019

(UL ANSI: No ANSI) High Performance Material For PKG Substrate

FEATURES

  • Tg ≥230°C (DMA), Td>395°C (5% loss, TGA)
  • T288>30min, Excellent Thermal Resistance
  • Lower X, Y/Z-axis CTE
  • High Flexural Modulus
  • Gooding punching & Drilling ability

APPLICATION

  • CoB(TF card, SIM card, etc.)
  • Dual CM

  09-24-2019

(UL ANSI: FR-4.0) High Tg, High Performance, Low CTE

FEATURES
● Anti-CAF capability
● Lead-free compatible
● Excellent thermal reliability
● Excellent through-hole reliability
● Excellent mechanical process ability
APPLICATIONS
Computer
Communication
Automotive electronics
Suitable for high multilayer PCB

  09-24-2019

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