Features:
• Not-PTFE
• Excellent high frequency performance due to
low dielectric tolerance and loss
• Stable electrical properties versus frequency
• Low thermal coefficient of dielectric constant
• Low Z-Axis expansion
• Low in-plane expansion coefficient
• Excellent dimensional stability
• Volume manufacturing process

Glass Reinforced Hydrocarbon Ceramic High Frequency Circuit Material

FEATURES
● Stable electrical properties versus frequency.
● Glass-reinforced hydrocarbon and ceramic dielectric ● Low Z-axis expansion and excellent dimensional
APPLICATIONS
● LNA/LNB
● High frequency wireless communication
● Satellite signal transmission equipment
● Microstrip and Cellular Base Station Antennas ● Base Station Antennas and Power Amplifiers

Glass Reinforced Hydrocarbon Ceramic High Frequency Circuit Material

FEATURES
● Glass-reinforced hydrocarbon & ceramic dielectric
● Excellent high frequency performance due to Low dielectric tolerance and loss.
● Stable electrical properties versus frequency.
● Low Z-CTE and excellent dimensional stability.

APPLICATIONS
Microstrip and Cellular Base Station Power Amplifiers;
Antennas; LNA/LNB;
High frequency wireless communication Satellite signal transmission equipment;

(UL ANSI: No ANSI) High Performance Material For PKG Substrate

FEATURES

• Tg ≥230°C (DMA), Td>395°C (5% loss, TGA)
• T288>30min, Excellent Thermal Resistance
• Lower X, Y/Z-axis CTE
• High Flexural Modulus
• Gooding punching & Drilling ability

APPLICATION

• CoB(TF card, SIM card, etc.)
• Dual CM

(UL ANSI: FR-4.0) High Tg, High Performance, Low CTE

FEATURES
● Anti-CAF capability
● Lead-free compatible
● Excellent thermal reliability
● Excellent through-hole reliability
● Excellent mechanical process ability
APPLICATIONS
Computer
Communication
Automotive electronics
Suitable for high multilayer PCB